IPC TR 465 2 : 1993
Withdrawn
Withdrawn
THE EFFECT OF STEAM AGING TIME AND TEMPERATURE ON SOLDERABILITY TEST RESULTS
Available format(s)
PDF
Language(s)
English
Published date
11-23-2012
Publisher
Withdrawn date
09-14-2023
Excluding Tax where applicable
Details the results of a two-year study to determine the effect of steam aging exposure on components. It concludes that 98 Degree C for 8 hours is the optimal condition for industry specifications for both component leads and printed boards.
| DocumentType |
Standard
|
| Pages |
62
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Withdrawn
|
| IPC TR 461 : 1979 | SOLDERABILITY EVALUATION OF THICK AND THIN FUSED COATINGS |
| IPC TR 465 1 : 1993 | ROUND ROBIN TEST ON STEAM AGER TEMPERATURE CONTROL STABILITY |
| IPC TR 462 : 0 | SOLDERABILITY EVALUATION OF PRINTED BOARDS WITH PROTECTIVE COATINGS OVER LONG-TERM STORAGE |
| IPC TR 466 : 1995 | TECHNICAL REPORT: WETTING BALANCE STANDARD WEIGHT COMPARISON TEST |
| IPC TR 464 : 1984 | ACCELERATED AGING FOR SOLDERABILITY EVALUATIONS |
| IPC TR 464 : 1984 | ACCELERATED AGING FOR SOLDERABILITY EVALUATIONS |
| IPC TR 465 1 : 1993 | ROUND ROBIN TEST ON STEAM AGER TEMPERATURE CONTROL STABILITY |
| IPC TR 465 3 : - | EVALUATION OF STEAM AGING ON ALTERNATIVE FINISHES, PHASE 2A |
| IPC TR 462 : 0 | SOLDERABILITY EVALUATION OF PRINTED BOARDS WITH PROTECTIVE COATINGS OVER LONG-TERM STORAGE |
| IPC J STD 003 : C | SOLDERABILITY TESTS FOR PRINTED BOARDS |
| IPC TR 466 : 1995 | TECHNICAL REPORT: WETTING BALANCE STANDARD WEIGHT COMPARISON TEST |
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