IPC TR 470 : 1974
Withdrawn
Withdrawn
THERMAL CHARACTERISTICS OF MULTILAYER INTERCONNECTION BOARDS
Available format(s)
PDF
Language(s)
English
Published date
01-01-1974
Publisher
Withdrawn date
09-13-2023
Excluding Tax where applicable
This study was undertaken to better understand the effects of different thermal environments on the reliability of copper PTHs.
| DocumentType |
Standard
|
| Pages |
26
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Withdrawn
|
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