IPC TR 551 : 1993
Withdrawn
Withdrawn
QUALITY ASSESSMENT OF PRINTED BOARDS USED FOR MOUNTING AND INTERCONNECTING ELECTRONIC COMPONENTS
Available format(s)
PDF
Language(s)
English
Published date
11-23-2012
Publisher
Withdrawn date
09-13-2023
Excluding Tax where applicable
It is a compendium of technical methods and techniques used for evaluating the quality aspects of present and future interconnection products and electronic assemblies. Also addresses base materials, conductor physical requirements, internal planes, construction, registration, plated through-holes, component mounting areas, cleaning evaluation, solder mask, and printed board electrical requirements.
| DocumentType |
Technical Report
|
| Pages |
126
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Withdrawn
|
| Supersedes |
| IPC 2220 : LATEST | IPC 2220 FAMILY OF DESIGN DOCUMENTS |
Summarise