IPC TR 578 : 1984
Withdrawn
Withdrawn
LEADING EDGE MANUFACTURING TECHNOLOGY REPORT
Available format(s)
PDF
Language(s)
English
Published date
11-23-2012
Publisher
Withdrawn date
09-13-2023
Excluding Tax where applicable
Contains the results of a Round Robin Study on Minimum Conductor Width and Plated-Through Holes in Rigid, Bare Copper, Double-sided Printed Wiring Boards.
| DocumentType |
Technical Report
|
| Pages |
100
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Withdrawn
|
| IPC A 38 : 1984 | FINE LINE ROUND ROBIN TEST PATTERN |
| IPC 2220 : LATEST | IPC 2220 FAMILY OF DESIGN DOCUMENTS |
| IPC TR 579 : 0 | ROUND ROBIN RELIABILITY EVALUATION OF SMALL DIAMETER PLATED-THROUGH HOLES IN PWBS |
| IPC D 279 : 0 | DESIGN GUIDELINES FOR RELIABLE SURFACE MOUNT TECHNOLOGY PRINTED BOARD ASSEMBLIES |
| IPC SM 785 : 0 | GUIDELINES FOR ACCELERATED RELIABILITY TESTING OF SURFACE MOUNT ATTACHMENTS |
Summarise