ISO/TS 10303-1682:2006
Withdrawn
View Superseded by
Industrial automation systems and integration — Product data representation and exchange — Part 1682: Application module: Interconnect 2D shape
Hardcopy , PDF
English
12-14-2006
04-09-2025
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Information requirements
4.1 Required AM ARMs
4.2 ARM entity definition
4.2.1 Component_2d_embedded_location
4.3 ARM function definitions
4.3.1 in_2d_assembly_context
4.3.2 no_2d_location_for_component
4.4 ARM rule definitions
4.4.1 component_in_assembly_2d_context
4.4.2 no_component_assembly_2d_location_for_area_component
5 Module interpreted model
5.1 Mapping specification
5.1.1 Component_2d_embedded_location
5.2 MIM EXPRESS short listing
Annex A MIM short names
Annex B Information object registration
B.1 Document identification
B.2 Schema identification
Annex C ARM EXPRESS-G
Annex D MIM EXPRESS-G
Annex E Computer interpretable listings
Bibliography
Index
ISO/TS 10303-1682:2006 specifies the application module for Interconnect 2D shape.
The following are within the scope of ISO/TS 10303-1682:2006:
- embedded physical component location;
- continuous planar feature shape definition.
| Committee |
ISO/TC 184/SC 4
|
| DocumentType |
Technical Specification
|
| Pages |
0
|
| PublisherName |
International Organization for Standardization
|
| Status |
Withdrawn
|
| SupersededBy |
| ISO/TS 10303-1618:2006 | Industrial automation systems and integration — Product data representation and exchange — Part 1618: Application module: AP210 interconnect design for microwave |