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ISO/TS 10303-1682:2006

Withdrawn

Withdrawn

View Superseded by

Industrial automation systems and integration — Product data representation and exchange — Part 1682: Application module: Interconnect 2D shape

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

12-14-2006

Withdrawn date

04-09-2025

Superseded by

ISO/TS 10303-1682:2010

US$96.00
Excluding Tax where applicable

1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Information requirements
  4.1 Required AM ARMs
  4.2 ARM entity definition
      4.2.1 Component_2d_embedded_location
  4.3 ARM function definitions
      4.3.1 in_2d_assembly_context
      4.3.2 no_2d_location_for_component
  4.4 ARM rule definitions
      4.4.1 component_in_assembly_2d_context
      4.4.2 no_component_assembly_2d_location_for_area_component
5 Module interpreted model
  5.1 Mapping specification
      5.1.1 Component_2d_embedded_location
  5.2 MIM EXPRESS short listing
Annex A MIM short names
Annex B Information object registration
  B.1 Document identification
  B.2 Schema identification
Annex C ARM EXPRESS-G
Annex D MIM EXPRESS-G
Annex E Computer interpretable listings
Bibliography
Index

ISO/TS 10303-1682:2006 specifies the application module for Interconnect 2D shape.

The following are within the scope of ISO/TS 10303-1682:2006:

  • embedded physical component location;
  • continuous planar feature shape definition.

Committee
ISO/TC 184/SC 4
DocumentType
Technical Specification
Pages
0
PublisherName
International Organization for Standardization
Status
Withdrawn
SupersededBy

ISO/TS 10303-1618:2006 Industrial automation systems and integration — Product data representation and exchange — Part 1618: Application module: AP210 interconnect design for microwave

US$96.00
Excluding Tax where applicable