ISO/TS 10303-1682:2018
Current
Current
Industrial automation systems and integration — Product data representation and exchange — Part 1682: Application module: Interconnect 2D shape
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
12-18-2018
US$96.00
Excluding Tax where applicable
ISO/TS 10303-1682:2018-11 specifies the application module for Interconnect 2D shape.
The following are within the scope of ISO/TS 10303-1682:2018-11:
- embedded physical component location;
- continuous planar feature shape definition.
| Committee |
ISO/TC 184/SC 4
|
| DocumentType |
Technical Specification
|
| Pages |
0
|
| PublisherName |
International Organization for Standardization
|
| Status |
Current
|
| Supersedes |
Summarise
US$96.00
Excluding Tax where applicable