ISO/TS 10303-1698:2010
Withdrawn
View Superseded by
Industrial automation systems and integration — Product data representation and exchange — Part 1698: Application module: Layered interconnect module design
Hardcopy , PDF
English
09-03-2010
04-09-2025
ISO/TS 10303-1698:2010-07 specifies the application module for Layered interconnect module design.
The following are within the scope of ISO/TS 10303-1698:2010-07:
- design features;
- material stackup;
- design patterns;
- metalization;
- functional and physical network listing;
- design layers;
- artwork layers;
- passages;
- items within the scope of application module Assembly component placement requirements, ISO/TS 10303-1634;
- items within the scope of application module Component grouping, ISO/TS 10303-1656;
- items within the scope of application module Edge shape feature, ISO/TS 10303-1673;
- items within the scope of application module Footprint definition, ISO/TS 10303-1646;
- items within the scope of application module Land, ISO/TS 10303-1692;
- items within the scope of application module Layered interconnect module with printed component design, ISO/TS 10303-1700.
| Committee |
ISO/TC 184/SC 4
|
| DocumentType |
Technical Specification
|
| Pages |
0
|
| PublisherName |
International Organization for Standardization
|
| Status |
Withdrawn
|
| SupersededBy | |
| Supersedes |
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