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ISO/TS 10303-1741:2006

Withdrawn

Withdrawn

View Superseded by

Industrial automation systems and integration — Product data representation and exchange — Part 1741: Application module: Sequential laminate assembly design

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

12-14-2006

Withdrawn date

04-09-2025

Superseded by

ISO/TS 10303-1741:2010

US$96.00
Excluding Tax where applicable

ISO/TS 10303-1741:2006 specifies the application module for Sequential laminate assembly design.

The following are within the scope of ISO/TS 10303-1741:2006:

  • sequence of application of an embedded component;
  • sequence of material buildup or lamination;
  • support for embedded component location;
  • items within the scope of application module Assembly module with interconnect component, ISO/TS 10303-1643;
  • items within the scope of application module Layered interconnect module design, ISO/TS 10303-1698.

Committee
ISO/TC 184/SC 4
DocumentType
Technical Specification
Pages
0
PublisherName
International Organization for Standardization
Status
Withdrawn
SupersededBy

ISO/TS 10303-1623:2006 Industrial automation systems and integration — Product data representation and exchange — Part 1623: Application module: AP210 laminate assembly design

US$96.00
Excluding Tax where applicable