ISO/TS 10303-1754:2006

Foreword
Introduction
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
4 Information requirements
  4.1 Required AM ARMs
  4.2 ARM entity definitions
      4.2.1 Blind_via
      4.2.2 Bonded_conductive_base_blind_via
      4.2.3 Buried_via
      4.2.4 Interfacial_connection
      4.2.5 Non_conductive_base_blind_via
      4.2.6 Plated_conductive_base_blind_via
  4.3 ARM subtype constraint definition
      4.3.1 via_subtypes
5 Module interpreted model
  5.1 Mapping specification
      5.1.1 Blind_via
      5.1.2 Bonded_conductive_base_blind_via
      5.1.3 Buried_via
      5.1.4 Interfacial_connection
      5.1.5 Non_conductive_base_blind_via
      5.1.6 Plated_conductive_base_blind_via
      5.1.7 via_subtypes
  5.2 MIM EXPRESS short listing
      5.2.1 MIM entity definitions
            5.2.1.1 blind_via
            5.2.1.2 bonded_conductive_base_blind_via
            5.2.1.3 buried_via
            5.2.1.4 interfacial_connection
            5.2.1.5 non_conductive_base_blind_via
            5.2.1.6 plated_conductive_base_blind_via
      5.2.2 MIM subtype constraint definition
            5.2.2.1 via_subtypes
Annex A - MIM short names
Annex B - Information object registration
  B.1 Document identification
  B.2 Schema identification
Annex C - ARM EXPRESS-G
Annex D - MIM EXPRESS-G
Annex E - Computer interpretable listings
Bibliography
Index
Figures
Tables

ISO/TS 10303-1754:2006 specifies the application module for Via component.

The following are within the scope of ISO/TS 10303-1754:2006:

• blind vias, connections between multiple layers of the printed circuit assembly where only one end is exposed;
• cylinder vias, where the cross-section shape is constant;
• tapered vias, where the cross-section shape may vary as the vertical distance changes;
• stacked vias, where multiple bind and buried vias share the same x y position;
• filled vias, where material may be inserted into the via during realization processes, which are within the scope of application module Layered interconnect module design, ISO/TS 10303-1698;
• buried vias, connections between multiple layers of the printed circuit assembly where neither end is exposed;
• interfacial connections, also known as through hole vias, which have both ends exposed;
• items within the scope of application module Interconnect module connection routing, ISO/TS 10303-1684;
• items within the scope of application module Layered interconnect module design, ISO/TS 10303-1698.