J-STD-075:2008
Superseded
Superseded
View Superseded by
Classification of Non-IC Electronic Components for Assembly Processes
Available format(s)
PDF
Language(s)
German
Published date
03-09-2008
Publisher
Superseded date
05-02-2026
Superseded by
Excluding Tax where applicable
J-STD-075 picks up where J-STD-020 left off by providing test methods to classify worst-case thermal process limitations for electronic components.
| DocumentType |
Standard
|
| Pages |
20
|
| PublisherName |
IPC by Global Electronics Association
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| JEDEC JEP30-A100A:2023 | Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements |
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