JEDEC JEP 30:2018
Superseded
View Superseded by
Part Model Guidelines for Electronic-Device Packages – XMLRequirements
Hardcopy , PDF
English
02-01-2018
08-29-2023
| DocumentType |
Standard
|
| Pages |
46
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Superseded
|
| SupersededBy |
This standard establishes the requirements for exchanging part data between partmanufacturers and their customers for electrical and electronic products.
| JEDEC JEP30-A100A:2023 | Part Model Assembly Process Classification Guidelines for Electronic-Device Packages – XML Requirements |
| JEDEC JEP30-T100A:2023 | Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements |
| JEDEC JEP30-S100:2023 | Part Model SupplyChain Guidelines for Electronic-Device Packages – XML Requirements |
Please Login or Create an Account so you can add users to your Multi user PDF Later.
Important note : All end users must be registered with an Account prior to user licenses being assigned.
Users cannot be edited or removed once added to your Multi user PDF.