JEDEC JEP 30-T100:2018
Superseded
View Superseded by
PART MODEL THERMAL GUIDELINES FOR ELECTRONIC-DEVICE PACKAGES - XML REQUIREMENTS
Hardcopy , PDF
English
02-01-2018
03-14-2023
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products.
| DocumentType |
Standard
|
| Pages |
26
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Superseded
|
| SupersededBy |
| JEDEC JEP30-K100:2025 | PartModel Design Rule Kits Guidelines for Electronic-Device Packages – XML Requirements |
Please Login or Create an Account so you can add users to your Multi user PDF Later.
Important note : All end users must be registered with an Account prior to user licenses being assigned.
Users cannot be edited or removed once added to your Multi user PDF.