JEDEC JEP30-E100G:2025
Superseded
View Superseded by
Part Model Electrical Guidelines for Electronic-Device Packages – XML Requirements
Hardcopy , PDF
English
02-01-2025
07-26-2025
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products.
| DocumentType |
Standard
|
| Pages |
558
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| JEDEC JEP30-M100:2025 | PartModel Generated ECAD - Models Guidelines for Electronic-Device Packages – XML Requirements |
| JEDEC JEP30D:2024 | Part Model Guidelines for ElectronicDevice Packages – XML Requirements |
| JEDEC JEP 104C:2002 | REFERENCE GUIDE TO LETTER SYMBOLS FOR SEMICONDUCTOR DEVICES |
| JEDEC JEP157A:2022 | RECOMMENDED ESD-CDM TARGET LEVELS |
| JEDEC JESD250C:2021 | GRAPHICS DOUBLE DATA RATE 6 (GDDR6) SGRAM STANDARD |
| JEDEC JESD223F:2024 | Universal Flash Storage Host Controller Interface (UFSHCI) |
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