JEDEC JEP30-T100B:2024
Superseded
View Superseded by
Part Model Thermal Guidelines for Electronic-Device Packages – XML Requirements
Hardcopy , PDF
English
08-01-2024
10-27-2025
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products.
| DocumentType |
Revision
|
| Pages |
44
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
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