JEDEC JEP30C:2023
Superseded
Superseded
View Superseded by
Part Model Guidelines for Electronic Device Packages – XML Requirements
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
11-01-2023
Publisher
Superseded date
02-22-2024
Superseded by
Free
Excluding Tax where applicable
This standard establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products.
| DocumentType |
Standard
|
| Pages |
68
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| JEDEC JEP30-P100D:2024 | Part Model Package Guidelines for Electronic-Device Packages – XML Requirements |
Summarise
Free
Excluding Tax where applicable