JEDEC JEP30F:2025
Superseded
View Superseded by
PartModel Guidelines for ElectronicDevice Packages – XML Requirements
Hardcopy , PDF
English
02-01-2025
10-27-2025
This part of JEP30 establishes the requirements for exchanging part data between part manufacturers and their customers for electrical and electronic products.
| DocumentType |
Standard
|
| Pages |
90
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| JEDEC JEP30-T100C:2025 | PartModel Thermal Guidelines for Electronic-Device Packages – XML Requirements |
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