JEDEC JESD 22-B113:2006
Superseded
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BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF SMT ICS FOR HANDHELD ELECTRONIC PRODUCTS
Published date
03-01-2006
Publisher
Superseded date
11-22-2018
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| DocumentType |
Standard
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| PublisherName |
JEDEC Solid State Technology Association
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| Status |
Superseded
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| SupersededBy |
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