JEDEC JESD 22-B116B : 2017
Superseded
View Superseded by
WIRE BOND SHEAR TEST METHOD
Hardcopy , PDF
English
04-01-2017
08-21-2026
This fully revised test provides a means for determining the strength of gold and copper ball bonds to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts.
| DocumentType |
Test Method
|
| Pages |
32
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| MIL-STD-883-1 Base Document:2019 | Environmental Test Methods for Microcircuits Part 1: Test Methods 1000-1999 |
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