JEDEC JESD22-B102E:2007
Withdrawn
View Superseded by
SOLDERABILITY
Hardcopy , PDF
English
10-01-2007
01-01-2014
This test method provides optional conditions for preconditioning and soldering for the purpose of assessing the solderability of device package terminations.
| Committee |
JC-14.1
|
| DocumentType |
Test Method
|
| Pages |
26
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Withdrawn
|
| SupersededBy |
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