JEDEC JESD63:1998
Superseded
View Superseded by
Standard Method for Calculating the Electromigration Model Parameters for Current Density and Temperature
Hardcopy , PDF
English
02-01-1998
05-16-2023
The method provides procedures that use linear regression analyses for calculating sample estimates, and their confidence intervals, of the electromigration model parameters for current density and temperature of thin-film metal interconnects used in microelectronic devices.
| DocumentType |
Standard
|
| Pages |
41
|
| PublisherName |
JEDEC Solid State Technology Association
|
| Status |
Superseded
|
| SupersededBy |
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