JIS C 0806-3:1999
Withdrawn
View Superseded by
Packaging of components for automatic handling -- Part 3: Packaging of surface mount components on continuous tapes Part 3: Packaging of surface mount components on continuous tapes
English
05-31-1999
10-23-2025
This Standard is applicable to the tape packaging of electronic components without leads or with lead stumps which are intended to be connected to electronic circuits. This Standard specifies the requirements for tape packaging of automatic component placement machines. It includes only those dimensions which are essential for the taping of components intended for the above-mentioned purposes.
| DocumentType |
Standard
|
| Pages |
16
|
| ProductNote |
Japanese PDF version unavailable from Intertek Inform.
|
| PublisherName |
Japanese Standards Association
|
| Status |
Withdrawn
|
| SupersededBy | |
| Supersedes |
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