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JIS C 5630-12:2014

Current

Current

Semiconductor devices -- Micro-electromechanical devices -- Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

Published date

02-20-2014

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DocumentType
Standard
ProductNote
Japanese PDF version unavailable from Intertek Inform.
PublisherName
Japanese Standards Association
Status
Current

Standards Relationship
IEC 62047-12:2011 Identical

2014 [20/02/2014]

Sorry this product is not available in your region.