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JIS C 60068-2-54:2009

Superseded

Superseded

View Superseded by

Environmental testing -- Part 2-54: Tests -- Test Ta: Solderability testing of electronic components by the wetting balance method Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

Available format(s)

PDF

Language(s)

English

Published date

07-20-2009

Superseded date

03-20-2019

Superseded by

JIS C 60068-2-69:2019

US$43.88
Excluding Tax where applicable

This Japanese Industrial Standard outlines the solder bath wetting balance method applicable for any shape of component terminations to determine the solderability.

DocumentType
Standard
Pages
23
PublisherName
Japanese Standards Association
Status
Superseded
SupersededBy
Supersedes

Reaffirmed 2014 2009(R2014) [20/10/2014]2009 [20/07/2009]96(R2007) [20/03/2007]96(R2001) [20/02/2001]96 [01/07/1996]90 [01/08/1991]

US$43.88
Excluding Tax where applicable