JIS C 60068-2-58:2002
Withdrawn
View Superseded by
Environmental testing -- Part 2: Tests -- Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) Part 2: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
English
04-30-2002
10-23-2025
This Standard outlines test Td, applicable to surface mounting devices (SMD). Soldering tests applicable to SMD in IEC 60068-2-69 and to other electrotechnical products are in JIS C 0050 and JIS C 0053, for which guidance is given in IEC 60068-2-44. This Standard provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices (SMD). The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow systems.
| DocumentType |
Standard
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| Pages |
21
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| PublisherName |
Japanese Standards Association
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| Status |
Withdrawn
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| SupersededBy | |
| Supersedes |
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