JIS C 60068-2-58:2016/AMENDMENT 1:2020
Current
Current
Environmental testing -- Part 2-58: Tests -- Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (Amendment 1)
Amendment of
Published date
03-23-2020
Publisher
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| DocumentType |
Amendment
|
| ProductNote |
Japanese PDF version unavailable from Intertek Inform.
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
Summarise
Sorry this product is not available in your region.