JIS C 60068-2-69:2009
Withdrawn
View Superseded by
Environmental testing -- Part 2-69: Tests -- Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
English
12-21-2009
10-23-2025
This Japanese Industrial Standard specifies test Te, solder bath wetting balance method and solder globule wetting balance method, applicable for surface mounting devices (SMD).
| DocumentType |
Standard
|
| Pages |
27
|
| ProductNote |
Japanese PDF version unavailable from Intertek Inform.
|
| PublisherName |
Japanese Standards Association
|
| Status |
Withdrawn
|
| SupersededBy |
| Standards | Relationship |
| IEC 60068-2-69:2007 | Identical |
Reaffirmed 2014 2009(R2014) [20/10/2014]2009 [21/12/2009]
A newer version of this standard is available.
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