JIS C 60068-2-83:2014
Current
Current
Environmental testing -- Part 2-83: Tests -- Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
Published date
09-22-2014
Publisher
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| DocumentType |
Standard
|
| ProductNote |
Japanese PDF version unavailable from Intertek Inform.
|
| PublisherName |
Japanese Standards Association
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 60068-2-83:2011 | Identical |
2014 [22/09/2014]
Summarise
Sorry this product is not available in your region.