JIS C 61191-1:2006
Withdrawn
Withdrawn
View Superseded by
Printed board assemblies -- Part 1: Generic specification -- Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Published date
03-25-2006
Publisher
Withdrawn date
10-23-2025
Superseded by
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| DocumentType |
Standard
|
| PublisherName |
Japanese Standards Association
|
| Status |
Withdrawn
|
| SupersededBy |
2006(R2010) [01/10/2010]2006 [25/03/2006]
| JIS Z 3284:1994 | Solder paste |
| JIS Z 3282:2006 | Soft solders -- Chemical compositions and forms |
| TR C 0027-2:2002 | Protection of electronic devices from electrostatic phenomena -- Part 2: User guide |
| JIS C 61191-4:2006 | Printed board assemblies -- Part 4: Sectional specification -- Requirements for terminal soldered assemblies |
| JIS C 5070:2002 | Surface mounting technology -- Part 2: Transportation and storage conditions of surface mounting devices (SMD) -- Application guide |
| TR C 0027-1:2002 | Protection of electronic devices from electrostatic phenomena -- Part 1: General requirements |
| JIS Z 3197:1999 | Testing methods for soldering fluxes |
| JIS Q 9001:2000 | Quality management systems -- Requirements |
| JIS C 60721-3-1:1997 | Classification of environmental conditions Part 3: Classification of groups of environmental parameters and their severities Storage Part 3: Classification of groups of environmental parameters and their severities Storage |
| JIS C 61191-3:2006 | Printed board assemblies -- Part 3: Sectional specification -- Requirements for through-hole mount soldered assemblies |
| JIS C 61191-2:2006 | Printed board assemblies -- Part 2: Sectional specification -- Requirements for surface mount soldered assemblies |
| JIS C 60068-2-20:1996 | Basic environmental testing procedures Part 2: Tests. Test T: Soldering Part 2: Tests. Test T: Soldering |
| JIS C 61191-3:2006 | Printed board assemblies -- Part 3: Sectional specification -- Requirements for through-hole mount soldered assemblies |
| JIS C 61191-4:2006 | Printed board assemblies -- Part 4: Sectional specification -- Requirements for terminal soldered assemblies |
| JIS C 61191-2:2006 | Printed board assemblies -- Part 2: Sectional specification -- Requirements for surface mount soldered assemblies |
Summarise
Sorry this product is not available in your region.