JIS C 6486:1996
Superseded
View Superseded by
Thin copper-clad laminates for multilayer printed wiring boards -- Glass fabric base, epoxy resin
English
01-31-1996
06-10-2025
This Japanese Industrial Standard specifies thin copper-clad laminates for multilayer printed wiring boards using glass babric base, epoxy resin (hereafter referred to as \"copper-clad laminates\").
| DocumentType |
Standard
|
| Pages |
12
|
| PublisherName |
Japanese Standards Association
|
| Status |
Superseded
|
| SupersededBy |
96(R2001) [20/09/2001]96 [01/01/1996]90 [01/10/1990]80
| JIS C 6481:1996 | Test methods of copper-clad laminates for printed wiring boards |
| JIS C 6480:1994 | General rules of copper-clad laminates for printed wiring boards |
| JIS E 5006:2005 | Electronic equipment for rolling stock |
| JIS C 6522:1996 | Prepreg for multilayer printed wiring boards -- Epoxy resin-impregnated glass cloth |
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