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JIS C 6511:1992

Superseded

Superseded

View Superseded by

Test methods of copper foil for printed wiring boards

Available format(s)

PDF

Language(s)

English

Published date

01-31-1992

Superseded date

05-07-2025

Superseded by

JIS C 6515:1998

US$13.79
Excluding Tax where applicable

This Japanese Industrial Standard specifies the test methods of copper foils for use in copper-clad laminates for printed wiring boards, copper-clad laminates for multi-layer printed wiring boards and copper-clad laminates for flexible printed wiring boards.

DocumentType
Standard
Pages
12
PublisherName
Japanese Standards Association
Status
Superseded
SupersededBy

92 [01/08/1992]

JIS C 6480:1994 General rules of copper-clad laminates for printed wiring boards

US$13.79
Excluding Tax where applicable