JIS C 6512:1992
Superseded
View Superseded by
Electrodeposited copper foil for printed wiring boards
English
01-31-1992
06-30-2025
This Japanese Industrial Standard specifies electrodeposited copper foil for use in copper-clad laminates for printed wiring boards, copper-clad laminates for multilayer printed wiring boards and copper-clad laminates for flexible printed wiring boards.
| DocumentType |
Standard
|
| Pages |
17
|
| PublisherName |
Japanese Standards Association
|
| Status |
Superseded
|
| SupersededBy |
92 [01/08/1992]
| JIS C 6472:1995 | Copper-clad laminates for flexible printed wiring boards (Polyester film, Polyimide film) |
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