JIS Z 3284-3:2014
Withdrawn
View Superseded by
Solder paste -- Part 3: Test methods for printability, viscosity, slump and tackiness
English
06-20-2014
10-23-2025
Introduction1 Scope2 Normative references3 Terms and definitions4 Test methodsAnnex JA (normative) - Characteristics evaluation table of solder pasteAnnex JB (informative) - Comparison table between JIS and corresponding International Standard
This Standard specifies the printability test, viscosity test, slump-in-printing test, slump-in-heating test and tackiness test of the solder paste for soldering used for the wiring connection, connection of parts, etc. of electric equipment, electronic equipment, communication equipment, etc.
| DocumentType |
Standard
|
| Pages |
23
|
| ProductNote |
Supersedes JIS Z3284. (06/2014)
|
| PublisherName |
Japanese Standards Association
|
| Status |
Withdrawn
|
| SupersededBy | |
| Supersedes |
2014 [20/06/2014]
| JIS Z 3284-1:2024 | Solder paste -- Part 1: Kinds and quality classification |
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