JIS Z 3910:2008
Superseded
View Superseded by
Methods for chemical analysis of solder
English
03-20-2008
10-25-2017
This Japanese Industrial Standard specifies the methods for analysis of chemical components of solder, such as tin, lead, silver, antimony, copper, bismuth, zinc, iron, aluminium, arsenic, cadmium, indium, gold and nickel specified in JIS Z 3282.
| DocumentType |
Standard
|
| Pages |
38
|
| PublisherName |
Japanese Standards Association
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
Reaffirmed 2012
| JIS Z 2611:1977 | General rules for photoelectric emission spectrochemical analysis of metal materials |
| JIS K 0121:2006 | General rules for atomic absorption spectrometry |
| JIS K 0119:2008 | General rules for X-ray fluorescence analysis |
| JIS H 0301:1997 | General rules for sampling, sample preparation and analytical testing of non-ferrous metals |
| JIS Z 8401:1999 | Guide to the rounding of numbers |
| JIS H 2105:1955 | Pig lead |
| JIS P 3801:1995 | Filter paper (for chemical analysis) |
| JIS K 0116:2003 | General rules for atomic emission spectrometry |
| JIS K 0050:2005 | General rules for chemical analysis |
| JIS Z 3282:2006 | Soft solders -- Chemical compositions and forms |
| JIS K 1105:2005 | Argon |
| JIS K 0211:2005 | Technical terms for analytical chemistry (General part) |
| JIS H 0321:1973 | General rules for inspection of non-ferrous metal materials |
| JIS Z 3198-2:2003 | Test methods for lead-free solders -- Part 2: Methods for testing of mechanical characteristics-tensile test Part 2: Methods for testing of mechanical characteristics-tensile test |
| JIS H 8624:1999 | Electroplated coatings of Tin-lead alloys |
| JIS Z 3282:2006 | Soft solders -- Chemical compositions and forms |
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