MIL-A-45059 Revision C:1983
Withdrawn
Adhesive for Bonding Chipboard to Terneplate, Tinplate, and Zincplate (No S/S Document)
12-02-1983
06-04-1996
1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. QUALITY ASSURANCE PROVISIONS
5. PREPARATION FOR DELIVERY
6. NOTES
Specifies a one-part, ready to use, brushable adhesive for use in bonding chipboard to terneplate, tinplate, and zincplate in the manufacture of ammunition fiber containers.
| DevelopmentNote |
C NOTICE 1 - Notice of Validation. C NOTICE 2 - Notice of Cancellation without replacement. (05/2004)
|
| DocumentType |
Standard
|
| Pages |
12
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Withdrawn
|
This specification covers a one-part, ready to use, brushable adhesive for use in bonding chipboard to terneplate, tinplate, and zincplate in the manufacture of ammunition fiber containers.
| MIL-HDBK-772 Base Document:1981 | Military Packaging Engineering (No S/S Document) |
| PPP-C-96 Revision E:1992 | Cans, Metal, 28 Gage and Lighter |
| MIL-STD-129 Revision R:2014 | Military Marking for Shipment and Storage |
| MIL-T-10727 Revision C:1989 | TIN PLATING: ELECTRODEPOSITED OR HOT-DIPPED, FOR FERROUS AND NONFERROUS METALS (S/S BY ASTM-B545, ASTM-B339) |
| MIL-STD-109 Revision C:1994 | QUALITY ASSURANCE TERMS AND DEFINITIONS (REFER TO AN ACCEPTABLE NON-GOVERNMENT STANDARD SUCH AS ISO-8402 OR ASQC-A8402) |
| UU-C-282 Revision D:1974 | Chipboard (S/S by A-A-1507) |
| MIL-STD-105 Revision E:1989 | Sampling Procedures and Tables for Inspection by Attributes (See Notice 3 for Replacement Information) |
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