MIL-DTL-47113 Revision E Notice 2 - Validation:2022
Current
Compound, Heat Sink, Silicone and/or Non-Silicone
English
05-11-2022
This specification covers a silicone or non-silicone heat sink compound which is applied to the base and mounting studs of transistors and diodes to provide a positive heat sink seal.
| DocumentType |
Notice
|
| Pages |
1
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Current
|
This specification covers a silicone or non-silicone heat sink compound which is applied to the base and mounting studs of transistors and diodes to provide a positive heat sink seal.
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