MIL-H-28719 Base Document:1970
Withdrawn
Withdrawn
Header, Hermetically Sealed (No S/S Document)
Available format(s)
PDF
Published date
03-31-1970
Publisher
Withdrawn date
03-12-2013
US$20.00
Excluding Tax where applicable
Describes types of hermetically sealed headers used in hermetically sealed components.
| DevelopmentNote |
NOTICE 2 - Notice of Validation. NOTICE 3 - Notice of Cancellation without Replacement. (04/2013)
|
| DocumentType |
Standard
|
| Pages |
24
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Withdrawn
|
This specification covers hermetically sealed headers designed to be used in hermetically sealed components.
| MIL M 28837 : 0 | MIXER STAGES, RADIO FREQUENCY GENERAL SPECIFICATION FOR |
| MIL A 28875 : 0 | AMPLIFIER, RADIO FREQUENCY AND MICROWAVE, SOLID STATE, GENERAL SPECIFICATION FOR |
| MIL PRF 39030 : C | DUMMY LOADS, ELECTRICAL, COAXIAL AND STRIPLINE, GENERAL SPECIFICATION FOR |
| MIL P 23971 : B | POWER DIVIDERS, POWER COMBINERS AND POWER DIVIDER/COMBINERS, GENERAL SPECIFICATION FOR |
| MIL A 3933 : E | ATTENUATORS, FIXED GENERAL SPECIFICATION FOR |
| MIL C 15370 : F | COUPLERS, DIRECTIONAL GENERAL SPECIFICATION FOR |
| MIL-DTL-28875 Revision C:2012 | Amplifiers, Radio-Frequency and Microwave, Solid-State, General Specification for |
| PPP-T-76 Revision C:1976 | Tape, Packaging, Paper (for Carton Sealing) (S/S by ASTM-D5486) |
| MIL-STD-129 Revision R:2014 | Military Marking for Shipment and Storage |
| PPP-B-636 Revision J:1981 | Boxes, Shipping, Fiberboard (S/S by ASTM-D1974 and ASTM-D5118) |
| PPP-B-566 Revision E:1974 | Boxes, Folding, Paperboard |
| MIL-STD-1276 Revision H:2013 | Leads for Electronic Component Parts |
| PPP-T-60 Revision E:1986 | Tape: Packaging, Waterproof (S/S by ASTM D5486/ASTM-D5486M) |
| QQ-C-320 Revision B:1974 | CHROMIUM PLATING (ELECTRODEPOSITED) (S/S BY SAE-AMS-QQ-C-320) |
| MIL-I-10 Revision B:1966 | Insulating Compound, Electrical, Ceramic, Class L (No S/S Document) |
| MIL-T-10727 Revision C:1989 | TIN PLATING: ELECTRODEPOSITED OR HOT-DIPPED, FOR FERROUS AND NONFERROUS METALS (S/S BY ASTM-B545, ASTM-B339) |
| QQ-S-365 Revision D:1985 | SILVER PLATING, ELECTRODEPOSITED, GENERAL REQUIREMENTS FOR (USERS MAY CONSULT ASTM-B700) |
| PPP-B-676 Revision E:1992 | Boxes, Setup |
| MIL G 45204 : C | GOLD PLATING, ELECTRODEPOSITED |
| QQ-S-571 Revision F:1994 | SOLDER, ELECTRONIC (96 TO 485 DEG. C) (S/S BY J-STD-004, J-STD-005 AND J-STD-006) |
| MIL C 45662 : 0 | CALIBRATION SYSTEM REQUIREMENTS |
| MIL-P-116 Revision J:1988 | PRESERVATION, METHODS OF (S/S BY MIL-STD-2073-1) |
| MIL-C-14550 Revision B:1983 | Copper Plating (Electrodeposited) (S/S by SAE-AMS2418) |
| TT-I-735 Revision A:1963 | Isopropyl Alcohol |
| MIL-STD-202 Revision H:2015 | Electronic and Electrical Component Parts |
| MIL C 26074 : E | COATINGS, ELECTROLESS NICKEL, REQUIREMENTS FOR |
| MIL-STD-105 Revision E:1989 | Sampling Procedures and Tables for Inspection by Attributes (See Notice 3 for Replacement Information) |
| QQ-N-290 Revision A:1971 | NICKEL PLATING (ELECTRODEPOSITED) (S/S BY SAE-AMS-QQ-N-290) |
Summarise
US$20.00
Excluding Tax where applicable