MIL-I-47151 Base Document:1974
Withdrawn
Insulating Compound, Electrical Embedding (No S/S Document)
06-07-1974
10-03-1990
Specifies aromatic amine cured epoxy resin for embedding or enclosing electronic equipment of components. Cured compound operates continuously at 300 deg F with intermittent rises to 370 deg F.
| DocumentType |
Standard
|
| Pages |
11
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Withdrawn
|
| MIL-STD-129 Revision R:2014 | Military Marking for Shipment and Storage |
| FED-STD-406 Revision A:1982 | PLASTICS: METHODS OF TESTING (S/S BY - SEE CANCELLATION NOTICE FOR RECOMMENDED SUPERSEDING ASTM TEST METHODS) |
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