MIL-P-81728 Revision A:1973
Withdrawn
Withdrawn
PLATING, TIN LEAD (ELECTRODEPOSITED (S/S BY SAE-AMS-P-81728)
Available format(s)
PDF
Published date
02-13-1973
Publisher
Withdrawn date
06-26-1998
US$20.00
Excluding Tax where applicable
Describes electro-deposited tin-lead plating.
| DocumentType |
Standard
|
| Pages |
19
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Withdrawn
|
| Standards | Relationship |
| SAE AMSP81728B | Similar to |
| MIL-E-16400 Revision H:1987 | Electronic, Interior Communication and Navigation Equipment, Naval Ship and Shore: General Specification for (S/S by MIL-STD-2036) |
| FF-R-556 Revision D:1981 | Rivet, Solid, Small; Rivet, Split, Small; Rivet, Tubular, Small Flat Washer (Burr); and Cap, Rivet, General Purpose |
| DOD-STD-2000-4 Revision A:1987 | GENERAL PURPOSE SOLDERING REQUIREMENTS FOR ELECTRICAL & ELECTRONIC EQUIPMENT (S/S BY MIL-STD-2000) |
| MIL-C-83515 Revision A:1985 | Connectors, Telecommunication, Polarized Shell, General Specification for (S/S by A-A-55528, A-A-55529, A-A-55530, A-A-55531, A-A-55532, and A-A-55533) |
| MIL C 21097 : E | CONNECTORS, ELECTRICAL, PRINTED WIRING BOARD, GENERAL PURPOSE GENERAL SPECIFICATION FOR |
| MIL-STD-193 Revision L:1991 | Painting, Procedures and Marking for Vehicles, Construction Equipment, Material Handling Equipment, and Spare Parts |
| MIL-STD-2000 Revision A:1991 | STANDARD REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES (NO S/S DOCUMENT) |
| MIL S 8805 : D | SWITCHES, AND SWITCH ASSEMBLIES, SENSITIVE AND PUSH, SNAP ACTION, GENERAL SPECIFICATION FOR |
| MIL-S-63540 Revision C:1995 | STUD, SELF-CLINCHING, GENERAL SPECIFICATION FOR (S/S BY NASM63540) |
| IPC D 949 : 1987 | RIGID MULTILAYER PRINTED BOARDS, DESIGN STANDARD FOR, |
| MIL S 5002 : D | SURFACE TREATMENTS AND INORGANIC COATINGS FOR METAL SURFACES OF WEAPONS SYSTEMS |
| MIL-T-55155 Revision C:1993 | TERMINALS, FEEDTHRU (INSULATED) AND TERMINALS, STUD (INSULATED AND NONINSULATED), GENERAL SPECIFICATION FOR (S/S BY A-A-59126) |
| MIL-STD-1250 Revision A:1992 | CORROSION PREVENTION AND DETERIORATION CONTROL IN ELECTRONIC COMPONENTS AND ASSEMBLIES (S/S BY MIL-HDBK-1250) |
| MIL S 83502 : B | SOCKET, PLUG IN ELECTRONIC COMPONENTS, ROUND STYLE, GENERAL SPECIFICATION FOR |
| MIL F 28861 : B | FILTER AND CAPACITOR, RADIO FREQUENCY/ELECTROMAGNETIC INTERFERENCE SUPPRESSION, GENERAL SPECIFICATION FOR |
| MIL-HDBK-1250 Revision A:1995 | Corrosion Prevention and Deterioration Control in Electronic Components and Assemblies (S/S by AS12500) |
| MIL-STD-1516 Revision B:1990 | Unified Code for Coating and Finishes for DOD Materiel (No S/S Document) |
| MIL C 83503 : A | CONNECTOR, ELECTRICAL, FLAT CABLE, AND/OR PRINTED WIRING BOARD, NONENVIRONMENTAL GENERAL SPECIFICATION FOR |
| MIL-STD-275 Revision E:1984 | PRINTED WIRING FOR ELECTRONIC EQUIPMENT (REFER TO IPC-D275 OR IPC-2221) |
| MIL C 24308 : C | CONNECTORS, ELECTRIC, RECTANGULAR, NON-ENVIRONMENTAL, MINIATURE, POLARIZED SHELL, RACK AND PANEL, GENERAL SPECIFICATION FOR |
| MIL S 83734 : F | SOCKETS, PLUG-IN ELECTRONIC COMPONENTS, DUAL-IN-LINE PACKAGES (DIPS) & SINGLE-IN-LINE PACKAGES (SIPS), GENERAL SPECIFICATION FOR |
| MIL C 28748 : B | CONNECTOR, ELECTRICAL, RECTANGULAR, RACK AND PANEL, SOLDER TYPE AND CRIMP TYPE CONTACTS, GENERAL SPECIFICATION FOR |
| MIL PRF 12883 : E | SOCKETS AND ACCESSORIES FOR PLUG-IN ELECTRONIC COMPONENTS, GENERAL SPECIFICATION FOR |
| IPC MC 324 : 1988 | PERFORMANCE SPECIFICATIONS FOR METAL CORE BOARDS |
| MIL C 55302 : E | CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES, RECEPTACLE |
| MIL-C-28859 Revision B:1990 | Connector Component Parts, Electrical Backplane, Printed-Wiring, General Specification For |
| MIL C 28804 : C | CONNECTORS, ELECTRIC, RECTANGULAR HIGH DENSITY, POLARIZED CENTER JACKSCREW |
| MIL-STD-2118 Base Document:1984 | Flexible and Rigid Flex Printed Wiring for Electronic Equipment Design Requirements for (S/S by IPC2221 and IPC2223) |
| MIL F 14072 : D | FINISHES FOR GROUND BASED ELECTRONIC EQUIPMENT |
| MIL S 5002 : D | SURFACE TREATMENTS AND INORGANIC COATINGS FOR METAL SURFACES OF WEAPONS SYSTEMS |
| ASTM B 567 : 1998 | Standard Test Method for Measurement of Coating Thickness by the Beta Backscatter Method |
| QQ-S-571 Revision F:1994 | SOLDER, ELECTRONIC (96 TO 485 DEG. C) (S/S BY J-STD-004, J-STD-005 AND J-STD-006) |
| MIL-F-14256 Revision F:1993 | Flux, Soldering, Liquid, Paste Flux, Solder Paste and Solder-Paste Flux, (for Electronic/Electrical use), General Specification for (S/S by J-STD-004, J-STD-005 and J-STD-006) |
| MIL-C-14550 Revision B:1983 | Copper Plating (Electrodeposited) (S/S by SAE-AMS2418) |
| QQ-S-624 Revision C:1961 | Steel Bar, Alloy, Hot Rolled and Cold Finished, (General Purpose) (S/S ASTM-A304, A322/A331) |
| MIL-STD-202 Revision H:2015 | Electronic and Electrical Component Parts |
| ASTM E 8 : 2004 | Standard Test Methods for Tension Testing of Metallic Materials |
| MIL-STD-105 Revision E:1989 | Sampling Procedures and Tables for Inspection by Attributes (See Notice 3 for Replacement Information) |
| QQ-N-290 Revision A:1971 | NICKEL PLATING (ELECTRODEPOSITED) (S/S BY SAE-AMS-QQ-N-290) |
Summarise
US$20.00
Excluding Tax where applicable
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