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MIL-PRF-31032-5 Revision B:2017

MIL-PRF-31032-5 Revision B:2017

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by
superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOPLASTIC, THERMOSETTING, OR THERMOPLASTIC AND THERMOSETTING RESIN BASE MATERIAL, WITH PLATED THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS

Available format(s)

PDF

Superseded date

05-05-2020

Language(s)

English

Publisher

US Military Specs/Standards/Handbooks

1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. VERIFICATION
5. PACKAGING
6. NOTES

Specifies the generic performance requirements for rigid, multilayered (three or more conductor layers) printed wiring boards (hereafter designated printed board) with plated holes, constructed of thermoplastic base materials, that will use soldering for component/part mounting.

Committee
FSC 5998
DocumentType
Standard
Pages
56
PublisherName
US Military Specs/Standards/Handbooks
Status
Superseded
SupersededBy

MIL-PRF-55110 Revision H:2014 Printed Wiring Board, Rigid, General Specification for

IPC A 600 : H ACCEPTABILITY OF PRINTED BOARDS
IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
IPC 2252 : 0 DESIGN GUIDE FOR RF/MICROWAVE CIRCUIT BOARDS
MIL-STD-883 Revision K:2016 TEST METHOD STANDARD - MICROCIRCUITS
ASTM E 345 : 2016 : REDLINE Standard Test Methods of Tension Testing of Metallic Foil
IPC 9252 : A REQUIREMENTS FOR ELECTRICAL TESTING OF UNPOPULATED PRINTED BOARDS
ASTM E 595 : 2015 : REDLINE Standard Test Method for Total Mass Loss and Collected Volatile Condensable Materials from Outgassing in a Vacuum Environment
IPC 2141 : A DESIGN GUIDE FOR HIGH-SPEED CONTROLLED IMPEDANCE CIRCUIT BOARDS
IPC TM 650 : 0 TEST METHODS MANUAL
MIL-PRF-31032 Revision C:2016 Printed Circuit Board/Printed Wiring Board, General Specification for
IPC 2251 : 0 DESIGN GUIDE FOR THE PACKAGING OF HIGH SPEED ELECTRONIC CIRCUITS
ASTM B 567 : 1998 Standard Test Method for Measurement of Coating Thickness by the Beta Backscatter Method
IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
MIL-STD-202-105 Base Document:2015 METHOD 105, BAROMETRIC PRESSURE (REDUCED)
IPC OI 645 : 0 STANDARD FOR VISUAL OPTICAL INSPECTION AIDS
MIL-STD-202-214 Base Document:2015 METHOD 214, RANDOM VIBRATION
MIL-STD-202-204 Base Document:2015 METHOD 204, VIBRATION, HIGH FREQUENCY

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PDF - English
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