NASA STD 8739.2 : 1999
Withdrawn
WORKMANSHIP STANDARD FOR SURFACE MOUNT TECHNOLOGY
01-01-1999
12-08-2011
1. Scope
2. APPLICABLE DOCUMENTS
3. DEFINITIONS AND ACRONYMS
4. GENERAL
5. TRAINING AND CERTIFICATION PROGRAM
6. FACILITIES, EQUIPMENT, AND MATERIALS
7. PREPARATION FOR SOLDERING
8. MATERIAL DEPOSITION AND PARTS PLACEMENT
9. SOLDERING PROCESSES
10. CLEANING OF SURFACE MOUNT PWA's
11. CLEANLINESS REQUIREMENTS
12. QUALITY ASSURANCE PROVISIONS
13. REWORK
14. GENERAL REQUIREMENTS FOR VERIFICATION
APPENDIX A - Oxidation/Cohesion and Slump Tests
APPENDIX B - VISUAL WORKMANSHIP STANDARDS
APPENDIX C - NASA TECHNICAL STANDARD IMPROVEMENT PROPOSAL
Describes NASA's requirements, procedures, and documenting requirements for hand and machine soldering of surface mount electrical connections.
| DevelopmentNote |
Supersedes NAS 5300.4 (09/2002) Expiration Date: 06-06-2013. (09/2008) 1999 Edition includes CHANGE 1 & CHANGE 2. (04/2011) Supersedes NASA MSFC STD 2904. (02/2017)
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| DocumentType |
Standard
|
| PublisherName |
National Aeronautics and Space Administration
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| Status |
Withdrawn
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| Supersedes |
| NASA MSFC STD 2904 : 2006 | MSFC TAILORING GUIDE FOR NASA-STD-8739.2, WORKMANSHIP STANDARD FOR SURFACE MOUNT TECHNOLOGY |
| NASA GSFC STD 6001 : 2016 | CERAMIC COLUMN GRID ARRAY DESIGN AND MANUFACTURING RULES FOR FLIGHT HARDWARE |
| NASA STD 8739.6 : 2016 | IMPLEMENTATION REQUIREMENTS FOR NASA WORKMANSHIP STANDARDS |
| NASA STD 5005(INT) : 2007 | THE DESIGN AND FABRICATION OF GROUND SUPPORT EQUIPMENT |
| NASA KSC DE 512-SM : 2012 | FACILITY SYSTEMS, GROUND SUPPORT SYSTEMS, AND GROUND SUPPORT EQUIPMENT GENERAL DESIGN REQUIREMENTS |
| NASA MSFC STD 246 : 2011 | STANDARD DESIGN AND OPERATIONAL CRITERIA FOR CONTROLLED ENVIRONMENTAL AREAS |
| NASA JSC 66491 : 2013 | STANDARD FOR JSC LEAD-FREE CONTROL PLANS (LFCP) |
| NASA JSC 27301 : 2009 | MATERIALS AND PROCESSES SELECTION, CONTROL, AND IMPLEMENTATION PLAN FOR JSC FLIGHT HARDWARE |
| IPC J STD 006 : C | REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS |
| IPC J STD 004 : B | REQUIREMENTS FOR SOLDERING FLUXES |
| IPC J STD 005 : A | REQUIREMENTS FOR SOLDERING PASTES |
| ANSI/NCSL Z540 1 : 94(R2002) | CALIBRATION - CALIBRATION LABORATORIES AND MEASURING AND TEST EQUIPMENT - GENERAL REQUIREMENTS |
| MIL-F-14256 Revision F:1993 | Flux, Soldering, Liquid, Paste Flux, Solder Paste and Solder-Paste Flux, (for Electronic/Electrical use), General Specification for (S/S by J-STD-004, J-STD-005 and J-STD-006) |
| TT-I-735 Revision A:1963 | Isopropyl Alcohol |
| MIL-STD-202 Revision H:2015 | Electronic and Electrical Component Parts |
| NASA STD 8709.22 : 2010 | SAFETY AND MISSION ASSURANCE ACRONYMS, ABBREVIATIONS, AND DEFINITIONS |
| O-M-232 Revision M:2016 | Methanol (Methyl Alcohol) |