NBN EN 62374-1 : 2010
Current
Current
SEMICONDUCTOR DEVICES - PART 1: TIME-DEPENDENT DIELECTRIC BREAKDOWN (TDDB) TEST FOR INTER-METAL LAYERS
Published date
01-12-2013
Publisher
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Specifies a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.
| DevelopmentNote |
Supersedes NBN EN 62374. (01/2011)
|
| DocumentType |
Standard
|
| PublisherName |
Belgian Standards
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| EN 62374-1:2010/AC:2011 | Identical |
Summarise
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