NEN EN 133000 : 1997

FOREWORD
1 SCORE
2 GENERAL
    2.1 Related documents
    2.2 Units, symbols and terminology
    2.3 Preferred values
    2.4 Marking
3 QUALITY ASSESSMENT PROCEDURES
    3.1 General
    3.2 Primary stage of manufacture
    3.3 Subcontracting
    3.4 Structurally similar components
    3.5 Qualification approval procedures
    3.6 Capability approval procedure
    3.7 Rework and repair work
    3.8 Release of delivery
    3.9 Certified test records
    3.10 Delayed delivery
    3.11 Alternative test methods
    3.12 Unchecked parameters
4 TEST AND MEASUREMENT PROCEDURES
    4.1 General
    4.2 Standard atmospheric conditions for testing
    4.3 Drying
    4.4 Visual examination and check of dimensions
    4.5 Insulation resistance
    4.6 Voltage proof
    4.7 Insertion loss
    4.8 Resistance
    4.9 Robustness of terminations
    4.10 Resistance to soldering heat
    4.11 Solderability
    4.12 Rapid change of temperature
    4.13 Vibration
    4.14 Bump
    4.15 Shock
    4.16 Container sealing
    4.17 Climatic sequence
    4.18 Damp heat, steady state
    4.19 Temperature rise
    4.20 Current overload
    4.21 Endurance
    4.22 Charge and discharge test
    4.23 Passive flammability
    4.24 Active flammability
    4.25 Solvent resistance of marking
    4.26 Component solvent resistance

Gives standard terms, inspection and test procedures to be used in sectional and detail specifications in the CECC system for electronic components.