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NEN EN IEC 60068-2-83 : 2011

Current

Current

The latest, up-to-date edition.

ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE

Published date

01-12-2013

Defines methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes.

DocumentType
Standard
PublisherName
Netherlands Standards
Status
Current

Standards Relationship
IEC 60068-2-83:2011 Identical
EN 60068-2-83 : 2011 Identical

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