NEN EN IEC 60749-15 : 2011 C11 2011
Current
Current
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES
Published date
01-12-2013
Publisher
Sorry this product is not available in your region.
Explains a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering or a soldering iron.
| DocumentType |
Standard
|
| PublisherName |
Netherlands Standards
|
| Status |
Current
|
| Standards | Relationship |
| IEC 60749-15:2010 | Identical |
| EN 60749-15:2010/AC:2011 | Identical |
Summarise
Sorry this product is not available in your region.