NEN EN IEC 61188-5-1 : 2002
Current
Current
The latest, up-to-date edition.
PRINTED BOARDS AND PRINTED BOARDS ASSEMBLIES; DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS; GENERIC REQUIREMENTS
Published date
01-12-2013
Publisher
Specifies information on land pattern geometries used for the surface attachment of electronic components. Provides the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet.
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