NEN EN IEC 61760-3 : 2010
Withdrawn
Withdrawn
View Superseded by
SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
Published date
01-12-2013
Publisher
Withdrawn date
04-01-2021
Superseded by
Sorry this product is not available in your region.
Provides a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for usage in through hole reflow soldering technology.
| DocumentType |
Standard
|
| PublisherName |
Netherlands Standards
|
| Status |
Withdrawn
|
| SupersededBy |
| Standards | Relationship |
| IEC 61760-3:2010 | Identical |
| EN 61760-3:2010 | Identical |
Summarise
Sorry this product is not available in your region.