NEN NPR IEC/PAS 60191-6-19 : 2008
Superseded
Superseded
View Superseded by
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-19: MEASUREMENT METHODS OF PACKAGE WARPAGE AT ELEVATED TEMPERATURE AND THE MAXIMUM PERMISSIBLE WARPAGE
Published date
01-12-2013
Publisher
Superseded date
06-29-2010
Superseded by
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Specifies the package warpage criteria and the package warpage measurement methods at elevated temperature for BGA, FBGA, and FLGA.
| DocumentType |
Standard
|
| PublisherName |
Netherlands Standards
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| IEC PAS 60191-6-19:2008 | Identical |
Summarise
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