NEN NPR IEC/PAS 62137-3 : 2008
Superseded
Superseded
View Superseded by
ELECTRONICS ASSEMBLY TECHNOLOGY - SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS
Published date
01-12-2013
Publisher
Superseded date
01-27-2012
Superseded by
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Explains the selection of an appropriate test method for reliability test of solder joints for various shapes and types of surface mount devices (SMD) and leaded devices, including various types of solder material.
| DocumentType |
Standard
|
| PublisherName |
Netherlands Standards
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| IEC PAS 62137-3:2008 | Identical |
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Sorry this product is not available in your region.