OVE EN 60191-4:2019
Current
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013/A1:2018)
Hardcopy
English
03-07-2019
This part of IEC 60191 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages.
| DocumentType |
Standard
|
| Pages |
0
|
| PublisherName |
Osterreichisches Normungsinstitut/Austrian Standards
|
| Status |
Current
|
| Standards | Relationship |
| EN 60191-4:2014/A1:2018 | Identical |
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