PD CLC/TR 62453-502:2009
Superseded
View Superseded by
Field device tool (FDT) interface specification Communication implementation for common object model. IEC 61784 CPF 2
Hardcopy , PDF
English
01-31-2010
03-01-2019
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions, symbols, abbreviated terms
and conventions
4 Bus category
5 Access to instance and device data
6 Protocol specific behavior
7 Protocol specific usage of general data types
8 Protocol specific common data types - DTMCIPDataTypeSchema
9 Network management data types
10 Communication data types
11 Channel parameter data types
12 Device identification
Annex A (informative) - Implementation hints
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Gives information for integrating the CIP[TM] technology into the COM based implementation of FDT interface specification (IEC/TR 62453-5).
| Committee |
GEL/65/3
|
| DevelopmentNote |
Supersedes 08/30180009 DC. (01/2010)
|
| DocumentType |
Standard
|
| Pages |
28
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
IEC/TR 62453-502, which is a technical report, provides information for integrating the CIP™ technology into the COM based implementation of FDT interface specification (IEC/TR 62453-5).
Communication Profile Family 2 (commonly known as CIP™1) defines communication profiles based on IEC 61158-2 Type 2, IEC 61158-3-2, IEC 61158-4-2, IEC 61158-5-2, and IEC 61158-6-2, IEC 62026-3. The basic profiles CP 2/1 (ControlNet™2), CP 2/2 (EtherNet/IP™3), and CP 2/3 (DeviceNet™1) are defined in IEC 61784-1 and IEC 61784-2. An additional communication profile (CompoNet™),also based on CIP™, is defined in [13].
This part of IEC 62453 specifies communication and other services.
This specification neither contains the FDT specification nor modifies it.
| Standards | Relationship |
| IEC TR 62453-502:2009 | Identical |
| CLC/TR 62453-502:2009 | Identical |
A newer version of this standard is available.
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